Description: Shows minimal wear such as frayed or folded edges, minor rips and tears, and/or slightly worn binding. May have stickers and/or contain inscription on title page. No observed missing pages.
Price: 111.03 USD
Location: Schenectady, New York
End Time: 2025-01-06T17:40:26.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Return policy details:
Number of Pages: Xv, 402 Pages
Publication Name: Packaging of HIGH POWER Semiconductor Lasers
Language: English
Publisher: Springer New York
Subject: Industrial Design / Packaging, Electronics / Semiconductors, Power Resources / Electrical, Power Resources / General
Publication Year: 2014
Item Weight: 29.7 Oz
Type: Textbook
Item Length: 9.3 in
Author: Lingling Xiong, Xingsheng Liu, Wei Zhao, Hui Liu
Subject Area: Technology & Engineering
Series: Micro- and Opto-Electronic Materials, Structures, and Systems Ser.
Item Width: 6.1 in
Format: Hardcover
