Description: About this Item The item is a book paperback or softback The Author Name is Rettberg, Achim,Zanella, Mauro C.,Amann, Michael The Title is Analysis, Architectures and Modelling of Embedded Systems : Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany Condition New Other Comments Pages Count - 328. Binding type - Perfect. Content Language - English Category - COMPUTERS / Software Development & Engineering / Systems Ana COMPUTERS / Networking / General COMPUTERS / Design, Graphics & Media / CAD-CAM We Use Stock Images Because we have over 2 million items for sale we have to use stock images, this listing does not include the actual image of the item for sale. The purchase of this specific item is made with the understanding that the image shown in this listing is a stock image and not the actual item for sale. For example: some of our stock images include stickers, labels, price tags, hyper stickers, obi's, promotional messages, signatures and or writing which may not be available in the actual item. When possible we will add details of the items we are selling to help buyers know what is included in the item for sale. The details are provided automatically from our central master database and can sometimes be wrong. Books are released in many editions and variations, such as standard edition, re-issue, not for sale, promotional, special edition, limited edition, and many other editions and versions. The Book you receive could be any of these editions or variations. If you are looking for a specific edition or version please contact us to verify what we are selling. Gift IdeasThis is a great Christmas gift idea. Hours of ServiceWe have many warehouses, some of the warehouses process orders seven days a week, but the Administration Support Staff are located at a head office location, outside of the warehouses, and typically work only Monday to Friday. Location ID 9000z iHaveit SKU ID 166399641
Price: 132.07 USD
Location: US
End Time: 2024-11-15T12:11:40.000Z
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Restocking Fee: No
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Fiction/Non-Fiction: Non-Fiction
Genre/Subject: COMPUTERS / Software Development Engineering / Systems Ana
Brand: SPRINGER
Weight: 0.46
Style: NA
Title: Analysis Architectures and Modelling of Embedded Systems Third
Release Title: Analysis Architectures and Modelling of Embedded Systems Third
Record Grading: New
Sleeve Grading: New
Platform: NA
Size: NA
Film/TV Title: Analysis Architectures and Modelling of Embedded Systems Thir
Colour: NA
Material: NA
Department: NA
Binding Type: Perfect
Item Height: 17.53
Main Stone: NA
Metal Purity: NA
Metal: NA
Connectivity: NA
Model: NA
Number of Pages: Xi, 315 Pages
Language: English
Publication Name: Analysis, Architectures and Modelling of Embedded Systems : Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, September 14-16, 2009, Proceedings
Publisher: Springer Berlin / Heidelberg
Publication Year: 2012
Subject: Intelligence (Ai) & Semantics, Cad-Cam, Social Aspects / Human-Computer Interaction
Item Weight: 17.8 Oz
Type: Textbook
Item Length: 9.3 in
Author: Mauro C. Zanella
Subject Area: Computers
Item Width: 6.1 in
Series: Ifip Advances in Information and Communication Technology Ser.
Format: Trade Paperback
