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Silver Conductive Adhesive For Printed Circuit Board, EMI & RFI 906, 2.5g

Description: Technical Product BulletinSILVER EPOXY ELECTRICAL CONDUCTOR NOT for Defroster and/or Gridline Repair. Windshield will shatter. Use Atom Adhesives Defroster Repair product.***** PRODUCT DESCRIPTION:AA-DUCT 906 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silverformulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive. AA-DUCT 906 cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similarand dissimilar substrates such as aluminum, copper, magnesium, steel, bronze nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards. AA-DUCT 906, because of its excellent continuity, has been used extensively in such diversified applications as, microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder. This unique formulation offers ease in handling due to its creamy consistency and versatile application by hand, automatic dispenser, silk-screening, transfer or stamping techniques. PRODUCT PROPERTIES:AppearanceSilverCure TypeHeat cure or Room temperatureBenefitsHigh strength Perfect bond EMI & RFI shielding Cold SolderSubstratesExcellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. UNCURED PROPERTIES:Viscosity @ 25 °C cpsPasteSilver coated ceramic , %50 to 75Pot Life @ RT1 HourMix ratio, by weight100:5 / Resin:HardenerShelf life1 Year CURE SCHEDULE:15 minutes@ 100°C30 minutes@ 60°C24 hours@ Room temperature CURED PROPERTIES:Volume Resistivity< 0.0015Hardness, Shore D81Compressive Strength, psi13,600Shrinkage Linear, in / in0.004Specific Gravity, 25°C / 25°C2.60Tensile Strength, psi8,900Compressive Strength, psi13,700 THERMAL PROPERTIES:Thermal Conductivity, btu / hr / ft2 / °F / in90Thermal Expansion Coefficient, (cm / cm / °C • 10-5)1.9Heat Distortion, °C90Operating Temperature Range, °C-50 to +165 GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). HOW TO USE: 1) Carefully clean and dry all surfaces to be bonded. 2) Apply AA-DUCT 906 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured. 3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use. 4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results. AVAILABILITY: This epoxy can be supplied in various different packages. Froo www.froo.com | Froo Cross Sell, Free Cross Sell, Cross promote, eBay Marketing, eBay listing Apps, eBay Apps, eBay Application

Price: 14.99 USD

Location: Warwick, Rhode Island

End Time: 2024-09-04T14:40:43.000Z

Shipping Cost: 0 USD

Product Images

Silver Conductive Adhesive For Printed Circuit Board, EMI & RFI 906, 2.5gSilver Conductive Adhesive For Printed Circuit Board, EMI & RFI 906, 2.5g

Item Specifics

All returns accepted: ReturnsNotAccepted

Brand: Atom Adhesives

Model: AA-DUCT 906-2

MPN: 906-2

Country/Region of Manufacture: United States

Keywords: flat cable, wave guides high frequency shields

Benefits 1: High strength Perfect bond

Benefits 2: EMI and RFI shielding Cold Solder

Typical Applications 1: Electrical, conductive, rmi efi shielding

Typical Applications 2: circuitry printed circuit board electronics repair

Substrates 1: aluminum, copper, magnesium, steel

Substrates 2: bronze, nickel, kovar, ceramic, glass

Substrates 3: phenolic and G-10 epoxy glass boards

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