Description: Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life. SMD291AX50T3 Solder Paste: Contains 50g of solder paste for SMD components Made with Sn63/Pb37 alloy: Provides reliable electrical and thermal conductivity No clean required: Saves time and effort in the soldering process Compatible with most SMD components: Suitable for use in electronic devices Made by : A trusted brand in electronics soldering and repair
Price: 21.34 USD
Location: Brentwood, New York
End Time: 2024-12-23T13:28:21.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Return policy details:
Color: silver
EAN: 0700254127156
ISBN: 0700254127156
Package Dimensions LxWxH: 2.01x1.89x1.34 Inches
Weight: 0.13 Pounds
Type: Does not apply
Brand: Chip Quik
MPN: Does not apply
